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Lenovo ThinkSystem SD665-N V3 Supercomputing Server


Lenovo Neptune™ direct water cooling to support high-performance processors and GPUsSupporting up to 2x 5th Generation AMD EPYC™ Processors up to 160 cores / 400WUp to 5 GPU nodes installed in the ThinkSystem DW612S enclosureFour NVIDIA HGX™ H100 or H200 GPUs up to 700W with NVLink for accelerationNVIDIA Connect X-7 4-chip VPI PCIe Gen5 Mezz Board for GPU direct I/O

Pretul afisat contine TVA (21%).

ThinkSystem SD665-N V3 Supercomputing Server

Lenovo Neptune™ direct water cooling to support high-performance processors and GPUsSupporting up to 2x 5th Generation AMD EPYC™ Processors up to 160 cores / 400WUp to 5 GPU nodes installed in the ThinkSystem DW612S enclosureFour NVIDIA HGX™ H100 or H200 GPUs up to 700W with NVLink for accelerationNVIDIA Connect X-7 4-chip VPI PCIe Gen5 Mezz Board for GPU direct I/O

Key Features

Lenovo Neptune™ Accelerated

A decade of experience in direct water-cooling sets Lenovo apart. Lenovo ThinkSystem SD665-N V3 is based on our fifth generation Lenovo Neptune™ direct water-cooling platform. The combination of market leading NVIDIA acceleration technology with the market leading water-cooling solution from Lenovo results in extreme performance in extremely dense packaging.

Accelerating Your Applications

ThinkSystem SD665-N V3 has 4 poweful NVIDIA H100 or H200 Tensor Core GPUs that are interconnected through NVLink delivering notable HPC performance improvements, AI training, and inference workloads. With NVIDIA® CUDA®, you can accelerate 700+ supported HPC applications and every major deep learning framework: Chemistry like Gaussian and GROMACS Finite Elements like LS-DYNA and Simulia Abaqus Fluid Dynamics like OpenFOAM and ANSYS Fluent Molecular Dynamics like NAMD and AMBER Weather and Climate like WRF and ICON

Solutions That Scale

V3 is a 3 fully integrated Lenovo Scalable Infrastructure (LeSI) solution and provides Best Recipe guides to warrant the interoperability of hardware, software and firmware among various Lenovo and third-party components. With Lenovo Intelligent Computing Orchestration (LiCO), you can support multiple users and scale within a single cluster environment. LiCO allows you to leverage a single cluster for diverse workload requirements.

Specifications

Form Factor
  • Full-wide 1U tray; 1 node+GPUs per tray
Chassis
  • DW612S Enclosure (6U)
Processor
  • Up to 2x 5th Generation AMD EPYC™ Processors per node
Memory
  • Up to 3.0TB using 24x 128GB 6400 MHz TruDDR5 RDIMM slots per tray
I/O Expansion
  • NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
Acceleration
  • NVIDIA HGX™ H100 or H200 4-GPU with 4x NVLink connected SXM5 GPUs
Storage
  • Up to 2x 2.5″ NVMe SSDs (7mm height) or 1x 2.5″ NVMe SSDs (15mm height) per node Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support
  • OS Software RAID
Network Interfaces
  • Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI)1GbE RJ45 (supports NC-SI)
Power Management
  • Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management
  • Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front access
  • All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear access
  • 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply
  • Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium) Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
Cooling Design
  • Direct Water Cooling at the heat source with up to 45°C inlet water temperature
OS Support
  • Red HatSUSE Rocky Linux (with LeSI support)Visit lenovopress.com/osig for more information.
Limited Warranty
  • 3-year customer replaceable unit and onsite limited warranty, next business day 9×5, service upgrades available
SKU: thinksystem-sd665-n-v3-supercomputing-server Categorii: , , ,
Form Factor
  • Full-wide 1U tray; 1 node+GPUs per tray
Chassis
  • DW612S Enclosure (6U)
Processor
  • Up to 2x 5th Generation AMD EPYCâ„¢ Processors per node
Memory
  • Up to 3.0TB using 24x 128GB 6400 MHz TruDDR5 RDIMM slots per tray
I/O Expansion
  • NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
Acceleration
  • NVIDIA HGXâ„¢ H100 or H200 4-GPU with 4x NVLink connected SXM5 GPUs
Storage
  • Up to 2x 2.5″ NVMe SSDs (7mm height) or 1x 2.5″ NVMe SSDs (15mm height) per node Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support
  • OS Software RAID
Network Interfaces
  • Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI)1GbE RJ45 (supports NC-SI)
Power Management
  • Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management
  • Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front access
  • All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear access
  • 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply
  • Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium) Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
Cooling Design
  • Direct Water Cooling at the heat source with up to 45°C inlet water temperature
OS Support
  • Red HatSUSE Rocky Linux (with LeSI support)Visit lenovopress.com/osig for more information.
Limited Warranty
  • 3-year customer replaceable unit and onsite limited warranty, next business day 9×5, service upgrades available

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