Supermicro Blade SBI-621E-1C3N (Complete System Only)
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Supermicro Blade SBI-621E-1C3N (Complete System Only)

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Blade SBI-621E-1C3N (Complete System Only)

Specifications

Product SKUs
SuperBlade Sled
  • SBI-621E-1C3N
Motherboard
  • MBD-B13DEE
Processor
CPU
  • Dual Socket E (LGA-4677)
  • 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
  • Intel® Xeon® CPU Max Series with High Bandwidth Memory (HBM)
Note
  • Up to 225W TDP CPUs (Air Cooling at 35°C)
  • Certain CPUs with higher TDP may be supported under specific conditions. Please refer to Thermal Matrix.
System Memory
Memory Capacity
  • 32 DDR5 DIMM slots
  • 2DPC with 5600MHz ECC RDIMM
On-Board Devices
Chipset
  • Intel® C741 chipset
Network Controllers
  • Onboard Dual 25G Ethernet
  • Optional 2x 25GbE port via Mezzanine expansion slot
MGMT/Security
  • IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust
Graphics
  • Aspeed AST2600
System BIOS
BIOS Type
  • 256Mb SPI Flash EEPROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • PCI 2.2
  • ACPI up to 3.0
  • USB Keyboard support
Dimensions
Height
  • 1.7″
Width
  • 9.83″
Depth
  • 24″
Weight
  • 8.36 lbs
Available Colors
  • Black
Front Panel
Buttons
  • Power On/Off button
  • KVM button
LEDs
  • Power LED
  • UID
  • Network Activity LED
  • Fault LED
Connector
  • SUV (Serial/USB/Video) Connector
Drive Bays
Hot-swap
  • 2 Hot-swap U.2 NVMe/SAS/SATA drive bays
  • 1 Hot-swap SAS drive bay; HW RAID w/ Broadcom 3108
Input / Output
TPM
  • 1 TPM 2.0 Header
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Optional Parts List
SKU: sbi-621e-1c3n Categorii: , , ,
Product SKUs
SuperBlade Sled
  • SBI-621E-1C3N
Motherboard
  • MBD-B13DEE
Processor
CPU
  • Dual Socket E (LGA-4677)
  • 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
  • Intel® Xeon® CPU Max Series with High Bandwidth Memory (HBM)
Note
  • Up to 225W TDP CPUs (Air Cooling at 35°C)
  • Certain CPUs with higher TDP may be supported under specific conditions. Please refer to Thermal Matrix.
System Memory
Memory Capacity
  • 32 DDR5 DIMM slots
  • 2DPC with 5600MHz ECC RDIMM
On-Board Devices
Chipset
  • Intel® C741 chipset
Network Controllers
  • Onboard Dual 25G Ethernet
  • Optional 2x 25GbE port via Mezzanine expansion slot
MGMT/Security
  • IPMI 2.0 / KVM over IP / Redfish API/TPM 2.0/Signed Firmware/HW Root of Trust
Graphics
  • Aspeed AST2600
System BIOS
BIOS Type
  • 256Mb SPI Flash EEPROM with AMI® BIOS
BIOS Features
  • Plug and Play (PnP)
  • PCI 2.2
  • ACPI up to 3.0
  • USB Keyboard support
Dimensions
Height
  • 1.7″
Width
  • 9.83″
Depth
  • 24″
Weight
  • 8.36 lbs
Available Colors
  • Black
Front Panel
Buttons
  • Power On/Off button
  • KVM button
LEDs
  • Power LED
  • UID
  • Network Activity LED
  • Fault LED
Connector
  • SUV (Serial/USB/Video) Connector
Drive Bays
Hot-swap
  • 2 Hot-swap U.2 NVMe/SAS/SATA drive bays
  • 1 Hot-swap SAS drive bay; HW RAID w/ Broadcom 3108
Input / Output
TPM
  • 1 TPM 2.0 Header
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)
Optional Parts List

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