- SuperServer SYS-822GA-NGR3
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| CPU |
- Dual Socket BR (LGA-7529)
- Intel® Xeon® 6900 series processors with P-cores
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| Core Count |
- Up to 128C/256T; Up to 504MB Cache per CPU
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| Note |
- Supports up to 500W TDP CPUs (Air Cooled)
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| Max GPU Count |
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| Supported GPU |
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| CPU-GPU Interconnect |
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| GPU-GPU Interconnect |
- 24x 200Gbe (48 x 112Gbps) PAM4 SerDes links split
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| Memory |
- Slot Count: 24 DIMM slots
- Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM/LRDIMM
- Max Memory (1DPC): Up to 6TB 8800MT/s ECC DDR5 MRDIMM
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| Memory Voltage |
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| Network Connectivity |
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| LAN |
- 1 RJ45 1 GbE Dedicated BMC LAN port
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| USB |
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| Video |
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| BIOS Type |
- AMI 32MB SPI Flash EEPROM
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| Software |
- SuperCloud Composer®
- Supermicro Server Manager (SSM)
- Super Diagnostics Offline (SDO)
- Supermicro Thin-Agent Service (TAS)
- SuperServer Automation Assistant (SAA) New!
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| Power configurations |
- Power-on mode for AC power recovery
- ACPI Power Management
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| Hardware |
- Trusted Platform Module (TPM) 2.0
- Silicon Root of Trust (RoT) – NIST 800-193 Compliant
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| Features |
- Cryptographically Signed Firmware
- Secure Boot
- Secure Firmware Updates
- Automatic Firmware Recovery
- System Lockdown
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| CPU |
- 7+1 Phase-switching voltage regulator
- Monitors for CPU Cores, Chipset Voltages, Memory
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| FAN |
- Fans with tachometer monitoring
- Pulse Width Modulated (PWM) fan connectors
- Status monitor for speed control
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| Temperature |
- Monitoring for CPU and chassis environment
- Thermal Control for fan connectors
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- SuperServer SYS-822GA-NGR3
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| Form Factor |
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| Model |
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| Height |
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| Width |
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| Depth |
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| Package |
- 27.6″ (H) x 29.5″ (W) x 51″ (D)
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| Weight |
- Gross Weight: 282 lbs (128 kg)
- Net Weight: 308 lbs (140 kg)
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| Available Color |
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| Buttons |
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| PCI-Express (PCIe) Configuration |
- Default2 PCIe 5.0 x16 FHFL slots 2 PCIe 5.0 x8 FHFL slots 1 PCIe 5.0 x4 AIOM slot (OCP 3.0 compatible)
- 2 PCIe 5.0 x16 FHFL slots
- 2 PCIe 5.0 x8 FHFL slots
- 1 PCIe 5.0 x4 AIOM slot (OCP 3.0 compatible)
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| M.2 |
- 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 22110(default))
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| Drive Bays Configuration |
- Default: Total 8 bays8 front hot-swap 2.5″ PCIe 5.0 NVMe drive bays
- 8 front hot-swap 2.5″ PCIe 5.0 NVMe drive bays
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| M.2 |
- 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 22110(default))
- View M.2 Options
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| Fans |
- Up to 10 Removable Heavy-Duty 80 x 80 x 80mm Fan(s)
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- 8x 3000W 8x 3000W Redundant Titanium Level (96%) power supplies Dimension (WxHxL)106.5 x 82.4 x 203.5 mm Input2880W: 200-207Vac 2880W: 200-207Vac / 50-60Hz 3000W: 207.1-240Vac 3000W: 240Vdc 3000W: 207.1-240Vac / 50-60Hz 3000W: 240Vdc / 50-60Hz +12VMax: 91.66A / Min: 0A (Vdc-240Vdc)Max: 91.66A / Min: 0A (200Vac-240Vac) 12V SBMax: 4A / Min: 0A Output TypeBackplanes (gold finger)
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| Dimension (WxHxL) |
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| Input |
- 2880W: 200-207Vac 2880W: 200-207Vac / 50-60Hz 3000W: 207.1-240Vac 3000W: 240Vdc 3000W: 207.1-240Vac / 50-60Hz 3000W: 240Vdc / 50-60Hz
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| +12V |
- Max: 91.66A / Min: 0A (Vdc-240Vdc)Max: 91.66A / Min: 0A (200Vac-240Vac)
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| 12V SB |
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| Output Type |
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| ROHS |
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| Environmental Spec. |
- Operating Temperature: 10°C to 35°C (50°F to 95°F)
- Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
- Operating Relative Humidity: 8% to 80% (non-condensing)
- Non-operating Relative Humidity: 8% to 90% (non-condensing)
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- 8x 3000W 8x 3000W Redundant Titanium Level (96%) power supplies Dimension (WxHxL)106.5 x 82.4 x 203.5 mm Input2880W: 200-207Vac 2880W: 200-207Vac / 50-60Hz 3000W: 207.1-240Vac 3000W: 240Vdc 3000W: 207.1-240Vac / 50-60Hz 3000W: 240Vdc / 50-60Hz +12VMax: 91.66A / Min: 0A (Vdc-240Vdc)Max: 91.66A / Min: 0A (200Vac-240Vac) 12V SBMax: 4A / Min: 0A Output TypeBackplanes (gold finger)
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